サイト内検索中国中外の共同研究チーム 新世代半導体材料分野で重要な進展
11:33:42 2026-01-16
'%3e%3cg%3e%3cpath%20d='M11.7561,15.1765L9.80488,15.1765Q6.75107,15.1752,2.601409,19.6406C2.3869,19.8714,2.000197537,19.7326,2.00000183717,19.4175Q2.0000000418698,19.4146,2.00000139562,19.4118C2.00000139562,13.5639,6.36781,8.82353,11.7561,8.82353L11.7561,5.20969C11.7561,4.34958,12.77,3.890755,13.4161,4.45845L21.1449,11.24875C21.5982,11.64701,21.5982,12.35299,21.1449,12.75125L13.4161,19.5416C12.77,20.1092,11.7561,19.6504,11.7561,18.790300000000002L11.7561,15.1765ZM9.80488,13.0588L13.7073,13.0588L13.7073,16.5614L18.8985,12L13.7073,7.43859L13.7073,10.94118L11.7561,10.94118C9.48619,10.938410000000001,7.32816,12.01066,5.846830000000001,13.8773C7.10665,13.3354,8.44972,13.0577,9.80488,13.0588Z'%20fill='%231F1F1F'%20fill-opacity='1'/%3e%3c/g%3e%3c/g%3e%3c/svg%3e)
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